1·The thermal conduction of a composite medium with variable thermal conductivities is discussed.
讨论了可变导热系数的复合介质的导热性。
2·Heat can be delivered by convection, radiation, and thermal conduction.
热气可由对流、辐射和热传导来传递。
3·The explicit solver for the thermal conduction in fluids has also been optimized for speed.
为液体的热传导的明白解决者也已经被为速度最佳化。
4·As a hydrodynamic consequence, thermal conduction results naturally in a strong shock wave.
作为热波传播的力学后果，热波自然地以强激波为终结。
5·Thermal conduction is very efficient in high temperature plasma of, for examPle, a protogalaxy.
在类似于原星系里的高温等离子体介质中，热传导具有很高的效率。
6·Therefore, the influence of dissipative phenomena (viscosity and thermal conduction) is negligible.
因此， 耗散现象（粘性与热传导）的影响可以忽略不计。
7·An unsteady thermal conduction model of its envelope was built and the dynamic load was calculated.
以某一低温实验装置为例，建立其围护结构非稳态传热数学模型，对动态负荷进行计算。
8·Thermal conduction is the main way of heat transfer and the whole proportion of thermal radiation is less than 35%.
导热是主要热传递方式，辐射换热总体比例不超过35%。
9·The noise source was firstly introduced into the differential equation of laser thermal conduction and the equation was solved.
首次在激光热传导方程中引入噪声项，推导了噪声影响下该激光热传导方程的解。
10·This paper suggests that the main cause of the beam drift of laser output is capillary sway due to unstable thermal conduction.
本文认为，输出光束的漂移主要是器件不稳定热传导引起毛细管摆动所致。
1·Heat can be delivered by convection, radiation, and thermal conduction.
热气可由对流、辐射和热传导来传递。
2·This paper suggests that the main cause of the beam drift of laser output is capillary sway due to unstable thermal conduction.
本文认为，输出光束的漂移主要是器件不稳定热传导引起毛细管摆动所致。
3·For devices formed on an oxide isolation layer, the poly - filled trench desirably penetrates this isolation layer thereby improving thermal conduction from the active regions to the substrate.
对于形成在氧化物隔离层上的器件，多晶填充的沟槽理想地穿透该隔离层从而改进从有源区到衬底的热传导。
4·We conclude that the distance that thermal conduction can influence is of the same order of magnitude as distant as what energy has to be transferred over on a galactic scale.
结论是，热传导可传播的距离与星系尺度上能量所需输运的距离是同量级的。
5·The thermal problems related with MCM are discussed, which are solved by developing an enhanced internal thermal conduction paths and an external cooling system.
与此有关的热问题，通过在封装中改善内部热传导路径以及改进外部冷却技术而得到解决。